G+OCA Pro XLY-001 Camera Ring Screen IC Grinding Polish Platform Votlage:220V EU Three Option :

Three Option :

WIFI Muti-purpose Microscope endoscope will offer crystal clear images of phone motherboard

Turn on the machine and wait for the metal plate become 80-100 degree(can not beyond 100 degree)

0mp C Mount 10-40mm Lens Manual Aperture Machine Vision Lens 1/1

welding repair is easier

G+OCA Pro XLY-001 Camera Ring Screen IC Grinding Polish Platform Votlage:220V EU Three Option :G+OCA Pro XLY 001 Multifunctional Grinding Platform Electric Grinder Polish Machine for mobile phone screen IC rear camera outer iron ring grinding removing. XLY 002 Chip Grinding Machine For iPhone screen IC mobile phone camera lens polishing repair. G+OCA Pro XLY 001 grinder with 5Pcs grinding head for iPhone 11 15 Pro Max screen IC grinding rear camera outer ring removing repair. Option: 1. G+OCA Pro XLY 001 standard set: host+5pcs grinding head.